| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| ICS932S203AG | IC |
ICS |
TSSOP |
04+ |
500 |
|||
| M6M80041FP | IC |
MIT |
SOP-10 |
01+ |
607 |
|||
| LTC3440EDD#PBF | IC |
LT |
QFN |
07+ |
50 |
|||
| PS8701-E3 | IC |
NEC/日电电子 |
SOP5 |
03+ |
5 |
|||
| CY7C130-55PC | IC |
CYPRESS/赛普拉斯 |
DIP |
03+ |
10 |
|||
| 100147-1 | IC |
AMP |
DIP |
0731+ |
50 |
|||
| AAT2556IWP-CA-T1 | IC |
ANALOGIC |
QFN |
06+ |
77 |
|||
| ALP115 | IC |
TOS |
SOP |
09+ |
14000 |
|||
| ISO7641FCDWR | IC |
TI/德州仪器 |
SOIC16 |
1544+ |
5 |
|||
| IRFL214TRPBF | IC |
VISHAY/威世 |
SOT223 |
1507+ |
11 |
|||
| IR3825MTRPBF | IC |
IR |
QFN |
16+ |
291 |
|||
| PIC24FJ256GB206-I/PT | IC |
MICROCHIP/微芯 |
TQFP64 |
16+ |
6 |
|||
| ADA4896-2ACPZ-R2 | IC |
ADI/亚德诺 |
LFCSP |
14+ |
2 |
|||
| XC3S2000-4FG456C | IC |
XILINX/赛灵思 |
BGA |
13+/11 |
23 |
|||
| TB2931HQ | IC |
TOS |
ZIP |
17+ |
259 |
|||
| S-80145ALMC-JA6T2U | IC |
SEIKO/精工 |
SOT23 |
15+/14+ |
18000 |
|||
| S29GL128S10TFIV20 | IC |
SPANSION/飞索半导体 |
TSOP |
14+ |
7 |
|||
| N25Q032A13ESE40F | IC |
MICRON/美光 |
SOP |
14+/15+ |
12783 |
|||
| DSP2A-DC24V-F | IC |
PANASONIC/松下 |
DIP |
10+ |
3 |
|||
| AD7416ARZ | IC |
ADI/亚德诺 |
SOP8 |
11+ |
7 |
|||
| K9F1G08U0D-SCB0 | IC |
SAMSUNG/三星 |
SOP |
1334+ |
9 |
|||
| SFH4258V | IC |
AMS OSRAM/艾迈斯欧司朗 |
SMD |
16+/17+ |
20000 |
|||
| MAX335ENG | IC |
MAXIM/美信 |
DIP |
99+ |
9 |
|||
| LNK6768K-TL | IC |
POWER |
ESOP11 |
1802+ |
729 |
|||
| P61089 | IC |
POWER |
SOP |
01+ |
17554 |
|||
| MCIMX6D5EYM10AD | IC |
NXP/Freescale |
BGA |
1546+ |
3 |
|||
| W27C512P-70 | IC |
WINBOND/华邦 |
PLCC |
0842+ |
260 |
|||
| HMC208AMS8E | IC |
ADI/亚德诺 |
MSOP |
14+ |
6 |
|||
| UPD70320L-8 | IC |
NEC/日电电子 |
PLCC |
01+ |
9 |
|||
| SI8662BD-B-ISR | IC |
SILICON |
SOIC16 |
22+ |
14 |